激光类型对SiC/SiC复合材料孔加工的影响

杨金华; 黄望全; 冯晓星; 刘虎; 艾莹珺; 周怡然; 焦健

doi:10.11868/j.issn.1005-5053.2022.000084

激光类型对SiC/SiC复合材料孔加工的影响

doi: 10.11868/j.issn.1005-5053.2022.000084

1.
中国航发北京航空材料研究院先进复合材料科技重点实验室, 北京100095
2.
中国航发商用航空发动机有限责任公司, 上海200241

详细信息

通讯作者:
焦健（1976—），男，博士，研究员，研究方向为陶瓷基复合材料，联系地址：北京市海淀区温泉镇环山村北京航空材料研究院（100095），E-mail: Jian.Jiao@biam.ac.cn

中图分类号: TQ174.1
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出版历程
- 收稿日期: 2022-05-31
- 修回日期: 2022-07-17
- 刊出日期: 2023-02-01

Effect of laser type on hole machining of SiC/SiC composites

1.
Key Laboratory of Advanced Composites, AECC Beijing Institute of Aeronautical Materials, Beijing 100095, China
2.
AECC Commercial Aircraft Engine CO., LTD., Shanghai 200241, China

摘要

摘要: SiC/SiC复合材料具有硬度高、脆性大等特点，属于典型的难加工材料，制备冷却孔主要采用激光加工的方法。毫秒激光与纳秒激光主要是利用光热作用迅速加热目标材料，使之熔融、气化，并借助高速气流来移除材料，由于纳秒激光的脉冲持续时间短、能量密度高，因此更容易实现材料的气化，并且引起的热效应较少。本工作分别采用毫秒激光与纳秒激光对SiC/SiC复合材料进行制孔，结果表明，对于直径0.6 mm、倾斜角度为25°的冷却孔，纳秒激光加工时长是毫秒激光的8.7倍；两种激光加工的孔均存在一定的锥度，其中纳秒激光加工的孔锥角为2.12°，毫秒激光加工的孔锥角为1.49°。毫秒激光加工的孔内部、孔出口端与入口端均存在残留物，并且孔周边存在明显的重熔-氧化区与热影响区；而纳秒激光加工的孔内部无明显残留物，激光入口端出现变色现象，出口端无变色现象，无明显重熔-氧化区与热影响区。元素分析结果表明，两种激光加工过程中均能够引起材料的氧化。
- SiC/SiC复合材料 /
- 激光加工 /
- 陶瓷基复合材料 /
- 纳秒激光 /
- 毫秒激光
Abstract: SiC/SiC composites have the characteristics of high hardness and brittleness, and they are typical difficult materials to process. Laser processing is mainly used to prepare cooling holes. Millisecond and nanosecond lasers mainly use photothermal action to rapidly heat the target material, melt and gasify it, and remove the material with the help of high-speed gas flow. Due to the short pulse duration and high peak power of nanosecond laser, it is easier to realize the gasification of materials, and the thermal effect caused is less. In this paper, millisecond and nanosecond lasers are used to make holes in SiC/SiC composites respectively. The results show that for cooling holes with a diameter of 0.6 mm and an inclination angle of 25 °, the processing time of nanosecond laser is 8.7 times longer than that of millisecond laser. The two kinds of laser processed holes have certain taper, in which the hole cone angle of nanosecond laser processing is 2.12 ° and that of millisecond laser processing is 1.49 °. There are residues in the inner, outlet end and inlet end of the hole processed by millisecond laser, and there are obvious remelting oxidation zone and heat affected zone around the hole. However, there is no obvious residue inside the hole processed by nanosecond laser, there is discoloration at the inlet end of the laser, there is no discoloration at the outlet end, and there is no obvious remelting oxidation zone and heat affected zone. The results of elemental analysis show that both kinds of laser processing can cause the oxidation of materials.
- SiC/SiC composites /
- laser processing /
- ceramic matrix composites /
- nanosecond laser /
- millisecond laser

HTML全文

图 1 两种激光加工试样孔断面宏观形貌　（a）HM样品；（b）NM样品；（1）入口端；（2）出口端

Figure 1. Cross-section morphologies of holes processed by two kinds of laser 　(a)sample HM；(b) sample NM；(1) inlet；(2)outlet

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图 2 两种激光加工试样孔表面宏观形貌　（a）HM样品；（b）NM样品；（1）入口端；（2）出口端

Figure 2. Surface morphologies of holes processed by two kinds of laser　 (a) sample HM；(b) sample HM；(1) inlet；(2) outlet

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图 3 两种激光加工试样　（a）HM样品；（b）NM样品；（1）孔断面SEM形貌；（2）残留氧化物SEM形貌；（3）残留氧化物组分分析

Figure 3. Samples processed by two kinds of laser　 (a) sample HM; (b) sample NM; (1) SEM image of cross-section of the hole; (2) SEM image of the oxide in the hole; (3) EDX of the oxide in the hole

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图 4 两种激光加工试样　（a）HM样品；（b）NM样品；（1）孔周边断裂面形貌；（2）孔中间部位表面形貌

Figure 4. Samples processed by two kinds of laser 　(a) sample HM; (b) sample NM; (1) cross-section morphology of the surrounding area of the hole; (d) surface morphology of the hole in the middle area

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图 5 毫秒激光加工试样　（a）重熔-氧化区元素组成；（b）热影响区元素组成。

Figure 5. Sample processed by milisecond laser 　(a) EDX of oxide layer； (b) EDX of HAZ

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图 6 两种激光加工试样孔CT形貌　（a）HM样品；（b）NM样品；（1）平行于孔中心线；（2）垂直于孔中心线方向

Figure 6. CT images of the holes processed by two kinds of laser　 (a) sample HM; (b) sample NM; (1) parallel to the axis of the hole; (d) perpendicular to the axis of the hole

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表 1 毫秒激光与纳秒激光单孔加工时间和尺寸精度

Table 1. Single-hole processing time and size precision of millisecond laser and nanosecond laser

Method	Processing time per hole /s	Major axis of inlet /mm	Minor axis of inlet /mm	Major axis of outlet /mm	Minor axis of outlet /mm	Taper angle /（°）
HM	45	2.007±0.053	0.797±0.022	1.707±0.081	0.627±0.018	1.49
NM	393	1.997±0.019	0.863±0.025	1.592±0.013	0.619±0.005	2.12

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