PDF(223 KB)
PDF(223 KB)
PDF(223 KB)
Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}TLP diffusion bonding of Si3N4 ceramics using Ti/Ni/Ti multilayer and controlling of joints′ quality
({{custom_author.role_en}}), {{javascript:window.custom_author_en_index++;}}| {{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
| 〈 |
|
〉 |