研究了固化温度对SYH2糊状胶粘剂剪切强度的影响.首先采用差热扫描量热法(DSC)研究了SYH2糊状胶粘剂固化反应动力学,根据Kissinger和Ozawa方法计算出胶粘剂的表观反应活化能分别为1023kJ/mol和1039kJ/mol,结合Crane公式求出反应级数为0943.还根据DSC分析数据研究了升温速率Φ与放热峰值温度Tp的关系,研究表明Tp与lnΦ呈线性关系.最后讨论了SYH2糊状胶粘剂固化温度对胶接试样剪切强度的影响,在固定的固化时间内升高固化温度有助于提高胶接强度,最佳固化工艺参数为130～140℃固化2h.
Abstract
An experimental study was undertaken to determine the effects of cure temperature on shear strength of SY H2 paste adhesive.Firstly,curing reaction kinetics of SY H2 paste adhesive was researched by differential scanning Calorimeter(DSC).According to Kissinger and Ozawa method,the apparent activation energy of curing reactions was determined to be 102.3kJ/mol and 103.9kJ/mol respectively.Kinetic order of curing reactions calculated according to Crane method was 0.943.Furthermore,correlation of scanning rate Φ with peak temperature Tp from DSC data was found that Tp and lnΦagree with linear relation.Finally,influence of cure temperature on shear strength of SY H2 paste adhesive was discussed.Increase of cure temperature in a given time can improve the bonding strength.Optimal curing parameter was suggested to be from 130℃to 140℃for two hours.
关键词
固化反应动力学 /
固化温度 /
剪切强度
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Key words
curing reaction kine /
curing temperature /
shear strength
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