冷却速率、保温时间对DD3单晶合金TLP连接接头组织和性能的影响
李晓红, 叶雷, 钟群鹏, 曹春晓, 毛唯
Effects of Cooling Rate and Holding Time on Microstructure and Property of TLP Bonded Joints for DD3 Single Crystal Superalloy
Xiao-hong LI, Lei YE, Qun-peng ZHONG, Chun-xiao CAO, Wei MAO
航空材料学报
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2015, (1): 1
-7
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DOI: 10.11868/j.issn.1005-5053.2015.1.001
