Ti和Ti/Ni/Ti连接钨与铜及其合金的界面结合机制与接头强度
邹贵生;赵文庆;吴爱萍;张德库;胡乃军;黄庚华;任家烈
Interfacial bonding and strength of tungsten to copper or its alloy joints with Ti foil and Ti/Ni/Ti multiple interlayers
ZOU Gui-sheng;ZHAO Wen-qing;WU Ai-ping;ZHANG De-ku;HU Nai-jun;HUANG Geng-hua;REN Jia-lie
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2004, (3): 36
-42
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