The Influence of Epoxy Resin with Different Molecular Weight on the Curing Process and the Properties of Composites

Nie Jiayang;Shih Shufang;Yu Zhennan

Journal of Aeronautical Materials ›› 1983, Vol. 3 ›› Issue (1) : 30-35.

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PDF(3663 KB)
Journal of Aeronautical Materials ›› 1983, Vol. 3 ›› Issue (1) : 30-35.

The Influence of Epoxy Resin with Different Molecular Weight on the Curing Process and the Properties of Composites

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Abstract

It is apparent that the influence of resin with different molecular weight and molecular weight distribution on the curing process and the properties of compo-sites by way of HPLC, DSC, TGA, DMA, viscoelasticimeter and other usual methods. The experiments result in that the epoxy resin with lower molecular weight has longer gel time, larger flow, higher Ta and Tb, lower AH, lower heat resistance (such as HDT, Tg, the temperature of heat degradation, weight loss) and lower retention of Young's Module at 50℃.

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Nie Jiayang, Shih Shufang, Yu Zhennan. The Influence of Epoxy Resin with Different Molecular Weight on the Curing Process and the Properties of Composites[J]. Journal of Aeronautical Materials, 1983, 3(1): 30-35

References

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May, C.A., 24th National SAMPE symposium and Exhibition,24(1979),P309
[3] Merrall, G.T.etal, The Influence of Epoxy Resin Matrix Properties on the Performance of Carbon-fibre Composites,Carbon Fibres their Composites and Applications, Paper No.22, (1972).
[4] Slianta, P. L., Flow of Prepregs isth Annual Technical Conference The Society of Plastics Industry, section 8-D, (1963).
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