INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING

Yu Xuebin;Zhang Guoding;Wu Renjie

Journal of Aeronautical Materials ›› 1995, Vol. 15 ›› Issue (1) : 15-21.

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PDF(370 KB)
Journal of Aeronautical Materials ›› 1995, Vol. 15 ›› Issue (1) : 15-21.

INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING

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Abstract

The effects of thermal circling on the curve of heat expansion and cold contraction are investigated. Itis found that the thermal circling curves of aluminum-matrix composites reinforced with carbon fiber forelectronic packaging are not close. The curve shape and close extent of thermal circling are related to rein-forcernents,sarnple orientation,thermal circling number of times and temperature range. These phenomenaare explained by micro-mechanics.

Key words

aluminum-matrix comp / thermal circling tes / thermal expansion / elec-tronic packagin

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Yu Xuebin, Zhang Guoding, Wu Renjie. INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING[J]. Journal of Aeronautical Materials, 1995, 15(1): 15-21

References

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Sugio Uchida.Proc 3rd Japan International SAMPE Symposium,Dec,7~10,1993.942
[3] Carl Zweben.JOM,1992(7):15
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