TEM study of borides formed at TLP bonding interface

XIE Yong-hui;LIU Xiao-fang;MAO Wei;LI Xiao-hong;YAN Ming-gao

Journal of Aeronautical Materials ›› 2000, Vol. 20 ›› Issue (3) : 89-93.

PDF(694 KB)
  • 中国科学引文数据库(CSCD)核心期刊
  • 中国核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
  • 英国INSPEC数据库
PDF(694 KB)
Journal of Aeronautical Materials ›› 2000, Vol. 20 ›› Issue (3) : 89-93.

TEM study of borides formed at TLP bonding interface

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 20(3): 89-93

References

List( Publishing order | Descend order by publishing year | Descend order by cited within ) Chart analysis

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(694 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉