Microstructure and properties of joint of H62 brass soldered using tin-lead solder

PAN Hui;SUN Ji-sheng;LIU Xiao-fang

Journal of Aeronautical Materials ›› 2000, Vol. 20 ›› Issue (4) : 26-29.

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PDF(356 KB)
Journal of Aeronautical Materials ›› 2000, Vol. 20 ›› Issue (4) : 26-29.

Microstructure and properties of joint of H62 brass soldered using tin-lead solder

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2000, 20(4): 26-29

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