The influence of aluminum contents on the microstructures and electrical properties of CuNi resistive films

DONG Xian-ping;WU Jian-sheng

Journal of Aeronautical Materials ›› 2001, Vol. 21 ›› Issue (2) : 34-38.

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Journal of Aeronautical Materials ›› 2001, Vol. 21 ›› Issue (2) : 34-38.

The influence of aluminum contents on the microstructures and electrical properties of CuNi resistive films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2001, 21(2): 34-38

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