Microstructure of TC4/72Ag-28Cu joint and production mechanism of Ti-Cu compound at the interface

WU Ming-fang;JIANG Cheng-Yu;YU Zhi-shui;LIANG Chao

Journal of Aeronautical Materials ›› 2001, Vol. 21 ›› Issue (3) : 29-32.

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PDF(275 KB)
Journal of Aeronautical Materials ›› 2001, Vol. 21 ›› Issue (3) : 29-32.

Microstructure of TC4/72Ag-28Cu joint and production mechanism of Ti-Cu compound at the interface

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2001, 21(3): 29-32

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