Interfacial bonding and strength of tungsten to copper or its alloy joints with Ti foil and Ti/Ni/Ti multiple interlayers

ZOU Gui-sheng;ZHAO Wen-qing;WU Ai-ping;ZHANG De-ku;HU Nai-jun;HUANG Geng-hua;REN Jia-lie

Journal of Aeronautical Materials ›› 2004, Vol. 24 ›› Issue (3) : 36-42.

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Journal of Aeronautical Materials ›› 2004, Vol. 24 ›› Issue (3) : 36-42.

Interfacial bonding and strength of tungsten to copper or its alloy joints with Ti foil and Ti/Ni/Ti multiple interlayers

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2004, 24(3): 36-42

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