Ultra-Fine-Grained Copper with High Strength and Conductivity Fabricated by Severe Deformation of Asymmetrical Accumulative Roll Bonding
WANG Jun-li;SHI Qing-nan;QIAN Tian-cai;WANG Shao-hua;YANG Xi-kun
Journal of Aeronautical Materials ›› 2010, Vol. 30 ›› Issue (3) : 14-18.
Ultra-Fine-Grained Copper with High Strength and Conductivity Fabricated by Severe Deformation of Asymmetrical Accumulative Roll Bonding
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