×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
Toggle navigation
中文
RSS
E-mail Alert
中国科学引文数据库(CSCD)核心期刊
中国核心期刊
文摘与引文数据库(Scopus)
剑桥科学文摘(CSA)
英国INSPEC数据库
Toggle navigation
Home
About Journal
About Journal
About Sponsor
Editorial Board
Open Access
Author Guidelines
Instruction for Authors
Paper Template
Reference Template
Author's Statement
FAQ
Browse
Just Accepted
Current Issue
Online First
Archive
Hot Special Issues
Virtual Issues
Recommended Articles
Most Article
Most Viewed
Most Download
Most Cited
Subscribe
Contact Us
Isothermal Solidification Process of TLP Diffusion Bonding for DD3 Superalloy
LI Xiao-hong;YE Lei;ZHONG Qun-peng;CAO Chun-xiao;XIONG Hua-ping
. 2011, (
6
): 1 -6 .
